IEI Integration ICE-DB-T6 - Manual (Page 8)

Type 6 Carrier Board Design Guide
Page VIII
List of Figures
Figure 1-1: ICE-QM770 ...................................................................................................................2
Figure 1-2: ICE-CV-D25501/N26001...............................................................................................4
Figure 1-3: ICE-DB-T6 ....................................................................................................................7
Figure 2-1: COM Express Type 6 Module Diagram ...................................................................11
Figure 3-1: PCI Express x16 Slot Example ................................................................................22
Figure 3-2: Intel Recommend Test Structure for PCI Express Data Eye Measurement ........24
Figure 3-3: PEG Lane Connection Topology Example .............................................................26
Figure 3-4: PEG Layout Trace Example .....................................................................................27
Figure 3-5: PCI Express x1 Slot Example ..................................................................................29
Figure 3-6: Express Card Slot Example .....................................................................................30
Figure 3-7: Mini Card Bottom Side Dimensions (Refer to www.pcisig.com)..........................31
Figure 3-8: Mini Card Top Side Dimensions (Refer to www.pcisig.com)................................32
Figure 3-9: Mini Card Connector (Refer to www.pcisig.com) ..................................................32
Figure 3-10: PCI Express Clock Buffer Example.......................................................................33
Figure 3-11: SATA 7-pin Connector Example............................................................................34
Figure 3-12: SATA LED Connection Example ...........................................................................35
Figure 3-13: Keyed Connector Protocol (Refer to USB2.0 Spec.) ...........................................38
Figure 3-14: USB Connector........................................................................................................38
Figure 3-15: RailClamp SRV05-4 Low Capacitance TVS Diode Array for ESD ......................39
Figure 3-16: 90 ohm Common Mode Choke at 100MHz for EMI ..............................................39
Figure 3-17: MIC2026 Block Diagram (Please refer the datasheet from MICREL ) ................40
Figure 3-18: USB Reference Design ...........................................................................................41
Figure 3-19: LVDS Power Control ...............................................................................................49
Figure 3-20: Backlight Control Circuit........................................................................................49
Figure 3-21: LCD Power Sequence Example (Refer to AUO G150XG01)................................50
Figure 3-22: Audio Analog Power Example ...............................................................................52
Figure 3-23: GbE LAN Connection Example (including Transformer)....................................54
Figure 3-24: Windbond W83627DHG Reference Design...........................................................58
Figure 3-25: Keyboard/Mouse Reference Schematic................................................................59
Figure 3-26: RS-232 Reference Schematic ................................................................................59