IEI Integration ICE-DB-T6 - Manual (Page 88)

Type 6 Carrier Board Design Guide
Page 78
Figure 5-5: Compact, Basic and Extended Form Factor
5.5 Heat Spread
One of the important factors for the system integration is the thermal design. The
heatspreader, usually a 3mm thick aluminum plate, acts as a thermal coupling device to
the Module. The heatspreader is thermally coupled to the CPU via a thermal gap filler and
on some Modules it may also be thermally coupled to other heat generating components
with the use of additional thermal gap fillers. Although the heatspreader is the thermal
interface where most of the heat generated by the Module is dissipated, it is not to be
considered as a heat sink. It has been designed to be used as a thermal interface
between the Module and the application specific thermal solution.
Modules should be equipped with a heatspreader. The overall module height from the
bottom surface of the module board to the heatspreader top surface shall be 13 mm for
both the Basic and Extended Modules. A 2-mm PCB with a 3-mm heatspreader may be
used which allows use of readily available standoffs.