IEI Integration ICE-DB-T6 - Manual (Page 87)

Type 6 Carrier Board Design Guide
Page 77
The COM Express PnP Initiative strongly recommends to use the following
location peg hole tolerances instead of those indicated in the footprint drawings
from the COM Express Specification as shown above:
• 0.8mm +0.075/-0.025mm
• 1.5mm +0.075/-0.025mm
5.4 COM Express Form Factors
COM Express specifies four form factors, as well as seven different types of connector
pinouts. The four form factors are referred to as Mini, Compact, Basic and Extended. The
Mini and Compact modules are targeted in mobile system and applications. The Mini
module footprint is 84mm x 55mm while the Compact module footprint is 95mm x 95mm.
The Basic module footprint is 125mm x 95mm and focuses on space-constrained, low
power systems which typically do not contain more than one horizontal mounted
SO-DIMM. The Extended footprint is slightly larger at 155mm x 110mm and supports up to
two full size, vertically mounted DIMM modules to accommodate larger memory
configurations for high-performance CPUs, chipsets and multiprocessor systems. The
placement of the shielded 220-pin connectors and the mounting holes are identical
between these two footprints.