IEI Integration ICE-DB-T6 - Manual (Page 89)

Type 6 Carrier Board Design Guide
Page 79
Figure 5-6: Overall Height for Heatspreader in Basic and Extended Modules
All dimensions in mm. Tolerances (unless otherwise specified): Z (height) dimensions
should be ± 0.8mm [±0.031”] from top of carrier board to top of heatspreader.
Heatspreader surface should be flat within 0.2mm [.008"] after assembly. Interface surface
finish should have a maximum roughness average (Ra) of 1.6μm [63μin]. The critical
dimension in Figure 6-8 is the module PCB bottom side to heatspreader top side. This
dimension shall be 13.00mm ± 0.65mm [±0.026”]. Figure 6-8 shows a cross section of a
module and heatspreader assembled to a Carrier Board using the 5mm stack height
option. If 8mm Carrier Board connectors are used, the overall assembly height increases
from 18.00mm to 21.00mm.
Figure 5-7: Basic Module Heatspreader