Altera Stratix IV GX FPGA Development Board - Manual (Page 73)

Chapter 2: Board Components 2–65
Power Supply
August 2012 Altera Corporation Stratix IV GX FPGA Development Board
Reference Manual
Table 2–59 lists the power measurement ADC component references and
manufacturing information.
Temperature Sense
Temperature monitoring for the Stratix IV GX FPGA die is achieved with a MAX1619
temperature sense device. The MAX1619 device connects to the MAX II CPLD
EPM2210 System Controller and the Stratix IV GX device by a 2-wire SMB interface.
The MAX 1619 device is located at address 0x1. This bus also routes to a single voltage
and power monitor chip for the 12-V power rail at address 0x2.
The OVERTEMPn and TSENSE_ALERTn signals are driven by the MAX1619 temperature
sense device based on a programmable threshold temperature. The OVERTEMPn signal
is driven to the MAX II EPM2210 System Controller. When the OVERTEMPn signal goes
high, the on-board fan is enabled. The MAX II EPM2210 System Controller can control
fan speed based on a register setting and can also override the MAX1619 device with
the FAN_FORCE_ON DIP switch to force the fan to be on constantly at full speed. For
more information on this control, refer to the MAX II EPM2210 System Controller
source code found in the development board installation directory dir>\stratixIVGX_4sgx230_fpga \examples\max2.
6 S4VCCPT 1.5 VCCPT Programmable power tech
7 S4VCCD_PLL 0.9 VCCD_PLL PLL digital
8 S4VCCA_GXB 3.0 VCCA XCVR analog TX/RX driver (mA only)
9 S4VCCIO_B5 2.5 VCCIO_B5 Bank 5 I/O power (HSMC port A)
A S4VCCIO_B6 2.5 VCCIO_B6 Bank 6 I/O power (HSMC port B)
B S4VCCIO_B1B2 2.5
VCCIO_B1 Bank 1 I/O power (FSM bus)
VCCIO_B2 Bank 2 I/O power (FSM bus)
C S4VCCIO_B3A 1.8 VCCIO_B3A Bank 3A I/O power (HDMI)
D S4VCCIO_B3B4 1.5
VCCIO_B3 Bank 3 I/O power (DDR3BOT)
VCCIO_B4 Bank 4 I/O power (DDR3BOT)
E S4VCC_GXB 1.1
VCCR XCVR analog receive
VCCT XCVR analog transmit
VCCL_GXB XCVR clock distribution
F — — — —
Note for Table 2–58 :
(1) The targeted power rails whose voltage values on the engineering silicon board differ from the production silicon board are listed in Table A–2
on page A–2 .
Table 2–58. Power Rail Measurements Based on the Rotary Switch Position (Part 2 of 2) (1)
Switch Schematic Signal Name Voltage (V) Device Pin Description
Table 2–59. Power Measurement ADC Component References and Manufacturing Information
Board Reference Description Manufacturer
Manufacturing
Part Number
Manufacturer
Website
U1, U36 8-channel differential 24-bit ADC Linear Technology LTC2418CGN#PBF www.linear.com
U9 1-channel differential 12-bit ADC Linear Technology LTC4151CDD#PBF www.linear.com