Intel 815 - Manual (Page 14)

Introduction
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14 Intel
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815 Chipset Platform Design Guide
1.1 Terminology
This section describes some of the terms used in this document. Additional power delivery term
definitions are provided at the beginning of Chapter 12, Power Delivery.
Term Description
Aggressor A network that transmits a coupled signal to another network is called the
aggressor network.
Aggressor A network that transmits a coupled signal to another network is called the
aggressor network.
AGP Accelerated Graphics Port
AGTL/AGTL+ Refers to processor bus signals that are implemented using either Assisted
Gunning Transceiver Logic (AGTL+) or its lower voltage variant (AGTL),
depending on which processor is being used.
Bus Agent A component or group of components that, when combined, represent a single
load on the AGTL+ bus.
Crosstalk The reception on a victim network of a signal imposed by aggressor network(s)
through inductive and capacitive coupling between the networks.
• Backward Crosstalk–coupling that creates a signal in a victim network that
travels in the opposite direction as the aggressor’s signal.
• Forward Crosstalk–coupling that creates a signal in a victim network that travels
in the same direction as the aggressor’s signal.
• Even Mode Crosstalk–coupling from single or multiple aggressors when all the
aggressors switch in the same direction that the victim is switching.
• Odd Mode Crosstalk–coupling from single or multiple aggressors when all the
aggressors switch in the opposite direction that the victim is switching.
GMCH Graphics and Memory Controller Hub. A component of the Intel ® 815 chipset
platform for use with the Universal Socket 370
ICH Intel ® 82801AA I/O Controller Hub component.
ISI Inter-symbol interference is the effect of a previous signal (or transition) on the
interconnect delay. For example, when a signal is transmitted down a line and the
reflections due to the transition have not completely dissipated, the following data
transition launched onto the bus is affected. ISI is dependent upon frequency,
time delay of the line, and the reflection coefficient at the driver and receiver. ISI
can impact both timing and signal integrity.
Network Length The distance between agent 0 pins and the agent pins at the far end of the bus.
Pad The electrical contact point of a semiconductor die to the package substrate. A
pad is only observable in simulation.
Pin The contact point of a component package to the traces on a substrate such as
the motherboard. Signal quality and timings can be measured at the pin.