HP Remote Assistant Card - Manual (Page 167)

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F Technical Specifications
This appendix provides specifications for the HP Remote Assistant EISA Board.
Feature Description
On-Board
Features 32-bit EISA Bus Master board (occupies a single
slot)
External 9-pin RS232 connector
Rear panel power-down reset switch
80C186 12.5 MHz, 16-bit microprocessor
256 KB 85ns Static RAM memory
256 KB of Flash ROM memory (firmware is
customer-upgradeable)
8 KB of nonvolatile (EEPROM) memory
Physical
Characteristics Board dimensions: 34 cm long x 11.5 cm wide x
1.8 cm thick
Weight: 0.53 kg (D2969C) (D2968C), 0.46 kg
(D2967C)
Environmental Operating temperature: 5 degrees to 40 degrees C
Conditions Nonoperating temperature: -40 degrees to 70
degrees C
Operating humidity: 20% to 80%
Nonoperating humidity: 5% to 95%
Operating altitude: 3,046 m
Nonoperating altitude: 12,200 m
Power 2 A at +5 V (10 W maximum)
Consumption 250 mA at +12 V (3 W maximum for trickle
charge)
1 A at +12 V (12 W maximum for fast battery
charge)
Battery Custom NiCad rechargeable 5-cell battery
6 V, 1100 mAh
Provides at least one hour of continual
board/modem usage