Vicor VI-J00 Family DC-DC Converters and Configurable Power Supplies - Manual (Page 88)

Design Guide & Applications Manual
For VI-200 and VI-J00 Family DC-DC Converters and Configurable Power Supplies
VI-200 and VI-J00 Family Design Guide Rev 3.5 vicorpower.com
Page 87 of 98
Apps. Eng. 800 927.9474 800 735.6200
23. Recommended Soldering Methods,
Tin Lead Pins, and InMate Sockets
5. Dry Joint. The solder has a dull gray appearance as
opposed to a bright silver surface. The solder joint
may have a mottled look as well, with jagged ridges.
It is caused by the solder joint moving before
completely cooled.
Recommended Solution. Immobilize the module
with respect to the PCB to ensure that the solder joint
cools properly.
6. Icicles. Jagged or conical extensions from solder fillet.
These are caused by soldering with the temperature
too low, or soldering to a highly heat-absorbent surface.
Recommended Solution. Increase the soldering
temperature, but not outside the recommended
limits. If necessary, use a higher power soldering iron.
7. Pinholes. Small or large holes in surface of solder
joint, most commonly occurring in wave-solder systems.
Recommended Solution. Increase preheat or
topside heater temperature, but not outside the
recommended limits.
Organizations
www.ipc.org
Commercial
www.aimsolder.com
www.alphametals.com
www.kester.com
www.multicore-association.org
References
Maxi / Mini / Micro Standoff Kits for Solder Mounted Modules*
Board Mounting Slotted Through-Hole Threaded
Thickness Options Baseplate Baseplate Baseplate
Nom. Mounting Pin Through-Hole Threaded Through-Hole Threaded Through-Hole
(Min/Max) Style Style Heat Sink Heat Sink Heat Sink Heat Sink Heat Sink
0.062"
In-Board
Short Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146
(0.055"/ 0.071") Tin/Lead Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
(1,5 mm)
On-Board L
Kit-18156 Kit-18157 Kit-18150 Kit-18152 Kit-18150
(1,4 mm / 1,8 mm) Bag-19132 Bag-19133 Bag-19126 Bag-19128 Bag-19126
0.093" Kit-18150 Kit-18151 Kit-18146 Kit-18147 Kit-18146
(0.084"/ 0.104")
In-Board L
2,4 mm
(2,1 mm / 2,6 mm)
Bag-19126 Bag-19127 Bag-19122 Bag-19123 Bag-19122
Table 23–2 — Standoff kits for solder mounted modules
* Kits include six (6) standoffs and screws. Mini and Micro modules require a minimum of four (4) standoffs.
100 piece bags contain standoffs only (#4-40 screws required).