INFICON IQM-233 Thin Film Deposition Controller PCI-Express Card Codeposition Software Operating Manual - Manual (Page 134)

A - 8
IP
N 07
4-
58
5-
P1
A
IQS-233 Operating Manual
TiB
2
4.500 *1.000 titanium boride
TiC 4.930 *1.000 titanium carbide
TiN 5.430 *1.000 titanium nitride
TiO 4.900 *1.000 titanium oxide
TiO
2
4.260 0.400 titanium (iv) oxide
TI 11.850 1.550 thallium
TIBr 7.560 *1.000 thallium bromide
TICI 7.000 *1.000 thallium chloride
TII 7.090 *1.000 thallium iodide (b)
U 19.050 0.238 uranium
U
3
O
8
8.300 *1.000 tri uranium octoxide
U
4
O
9
10.969 0.348 uranium oxide
UO
2
10.970 0.286 uranium dioxide
V 5.960 0.530 vanadium
V
2
O
5
3.360 *1.000 vanadium pentoxide
VB
2
5.100 *1.000 vanadium boride
VC 5.770 *1.000 vanadium carbide
VN 6.130 *1.000 vanadium nitride
VO
2
4.340 *1.000 vanadium dioxide
W 19.300 0.163 tungsten
WB
2
10.770 *1.000 tungsten boride
WC 15.600 0.151 tungsten carbide
WO
3
7.160 *1.000 tungsten trioxide
WS
2
7.500 *1.000 tungsten disulphide
WSi
2
9.400 *1.000 tungsten silicide
Y 4.340 0.835 yttrium
Y
2
0
3
5.010 *1.000 yttrium oxide
Yb 6.980 1.130 ytterbium
Yb
2
O
3
9.170 *1.000 ytterbium oxide
Zn 7.040 0.514 zinc
Zn
3
Sb
2
6.300 *1.000 zinc antimonide
ZnF
2
4.950 *1.000 zinc fluoride
ZnO 5.610 0.556 zinc oxide
Table A-1 Material table (continued)
Formula Density Z-Ratio Material Name