BECKHOFF ET1100 - Manual (Page 113)

Mechanical Specifications
Slave Controller – ET1100 Hardware Description III-99
11 Mechanical Specifications
11.1 Package Information
A 10mm x 10mm TFBGA (Thin-profile Fine-pitch BGA) with 128 balls is used for the ET1100. The
pinout of the ET1100 is optimized for easy escape routing using 0.7mm/0.3mm vias inside the free
center of the BGA, because the inner two ball rings are mainly used for power supply.
The ET1100 is RoHS compliant. The material of the balls is 95.5% Sn / 4% Ag / 0.5% Cu.
Non-solder mask defined pads (NSMD) with a copper pad diameter of 300 µm and an actual solder
mask opening diameter of 400 µm (after widening) are recommended. Each pad (whether used or
unused) should only be connected by a single trace, and the trace width should be small and identical
for all pads, e.g. 125 µm.
Figure 54: Package Outline