Artesyn MVME51005E SBC Installation and Use (July 2014) - Manual (Page 142)

Thermal Analysis
MVME51005E Single Board Computer Installation and Use (6806800A38D) 144
C.2 Component Temperature Measurement
This section outlines general temperature measurement methods. For the specific types of
measurements required for thermal evaluation of this board, see
Table C-1 .
C.2.1 Preparation
We recommend 40-gage thermocouples for all thermal measurements. Larger gage
thermocouples can wick heat away from the components and disturb air flowing past the
board.
Allow the board to reach thermal equilibrium before taking measurements. Most circuit boards
reach thermal equilibrium within 30 minutes. After the warm up period, monitor a small
number of components over time to assure that equilibrium is reached.
C.2.2 Measuring Junction Temperature
Some components have an on-chip thermal measuring device such as a thermal diode. For
instructions on measuring temperatures using the on-board device, refer to the MVME5100
component manufacturer’s documentation listed in
Appendix D, Related Documentation .
C.2.3 Measuring Case Temperature
Measure the case temperature at the center of the top of the component. Make sure there is
good thermal contact between the thermocouple junction and the component. We
recommend you use a thermally conductive adhesive such as Loctite 384.
If components are covered by mechanical parts such as heatsinks, you need to machine these
parts to route the thermocouple wire. Make sure that the thermocouple junction contacts only
the electrical component. Also make sure that heatsinks lay flat on electrical components.
Figure C-3 shows one method of machining a heatsink base to provide a thermocouple routing
path.