Vicor Micro Family of DC-DC Converter - Manual (Page 4)

Design Guide & Applications Manual
For Maxi, Mini, Micro Family DC-DC Converters and Configurable Power Supplies
Maxi, Mini, Micro Design Guide Rev 4.9 vicorpower.com
Page 3 of 88
Apps. Eng. 800 927.9474 800 735.6200
1. High Density DC-DC Converter Technology
Key to the design of Maxi, Mini, Micro converters is its
high level of component-level integration. (Figure 1–2)
With the aid of hybrid technology, the device packs all
control functions and active circuitry into two (primary
and secondary side) ICs occupying a total volume of less
than 1/10 in
3 (1,6 cm 3 ) each.
With Maxi, Mini, Micro devices, the plated-cavity trans-
former cores use copper armor, plated onto the ferrite
core, to more closely confine the magnetic flux to couple
widely separated primary and secondary windings. The
wider separation provides greater isolation and therefore
lowers input-to-output parasitic capacitance and noise.
The plated cavity also serves to conduct heat away from
the transformer to the baseplate, thus increasing the
power-handling capability of the power train and minimiz-
ing temperature rise.
The power-train assembly is contained between the
baseplate and a terminal-block assembly, with input and
output pins recessed. This allows the converter body to be
mounted into an aperture in the PCB to reduce the height
above board. The modules may be wave soldered or
plugged into through-hole or surface-mount sockets.
The Maxi, Mini, Micro devices use a proprietary, low-noise,
integrated power device that has an order of magnitude
lower parasitic effect.
The advances made in the overall design of the Maxi,
Mini, Micro Family DC-DC converters have been comple-
mented by equally significant advances in the technology
used to manufacture them. Vicor invested in a custom,
fully-automated assembly line specifically designed for the
assembly of Maxi, Mini, Micro power components. To
further augment its Maxi, Mini, Micro product offering,
Vicor has created an online user-interface tool,
PowerBench TM , that allows customers to specify DC-DC
module requirements anytime, anywhere via the internet.
Bottom View
• Standard MLP power devices
• Efficient pick-and-place assembly
Top View
• Surface mount components for greater
manufacturing efficiency
• Standard reflow process
Baseplate
• Simplified baseplate construction
Complete Assembly
• Insert molded terminal block for more
accurate pin positioning
• One piece cover with label
• Encapsulated for superior thermal performance
Figure 1–2 — Maxi assembly shows high level of integration.
Model Number
Serial No. & Date Code