Echelon FT 3150 Smart Transceiver - Manual (Page 138)

Appendix C - Design and Handling Guidelines
132 FT 3120 / FT 3150 Smart Transceiver Data Book
Figure C.4 Switching Currents for C
L
< 5pF
Figure C.5 Switching Currents for C
L
= 50pF
Board Soldering Considerations
Soldering Through-hole Parts (FT-X1)
Please refer to individual User’s Guides and Data Books for product-specific details. All through-hole parts should be
soldered using a standard through-hold method with lead temperatures of 250ºC maximum for 5 seconds for both
non-RoHS and RoHS parts.
BUFFERED DEVICE: INPUT t
r
, t
f
≤ 500ns, C
L
< 5pF
I GND
I CC
V
out
I GND
I CC
V
ou
t
BUFFERED DEVICE: INPUT t
r
, t
f
≤500 ns, C
L
< 50pF