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Teledyne LeCroy WaveLink Differential Probe Series (13-25 GHz) User Manual

Page 42

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WaveLink Series Differential Probe (13-25 GHz)

36

WL-HBW-A-OM-E Rev B

P

LATFORM

/C

ABLE

A

SSEMBLY

B

OARD

E

DGE

C

LIP

The Platform/Cable Assembly Location Clip can be used to give support to the probe and
Interconnect Lead when the test points are located close to the edge of the board under test. It's
also useful for holding the probe assembly while soldering the solder-in interconnect lead to your
device under test.

Slide the probe cable into the clamp opening and move the probe so that the probe's strain relief is
located in the opening. Close the clamp.

Slide the probe into the board edge clip