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Solder-in interconnect leads – Teledyne LeCroy WaveLink Differential Probe Series (13-25 GHz) User Manual

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WaveLink Series Differential Probe (13-25 GHz)

10

WL-HBW-A-OM-E Rev B

Solder-in Interconnect Leads

The probe lead provides ability to access the signal on the device under test (DUT) without
disturbing the operation of the DUT. The solder-in probe lead provides the highest possible
performance at the expense of a non-movable installation. The design of the solder-in lead
minimizes customer circuit loading with the probe connected by providing high probe AC loading
and a wide frequency range where AC circuit loading is minimized.

The solder-in lead supplied with the kit consists of two small, pre-installed and pre-trimmed
attenuating (damping) resistors connected to a flexible transmission line terminating in a connector
mating with the amplifier. Because resistors and resistor lengths are small, this solder-in lead
provides the maximum signal fidelity and minimum circuit loading at the highest frequencies. The
resistors are soldered directly into the connection points of the circuit under test, providing a
reliable, intermittence-free connection.

Five replacement damping resistors are provided with each solder-in lead. Resistors may be
replaced in the field if the tip is damaged. See Replacing Damping Resistors on the Solder-in
Interconnect Lead
(on page 39) for more information.

NOTE:

At initial product launch, there were two different solder-in leads - a D1x05-SI and a
D2005-SI. The D2005-SI was used with the 20 GHz and the D1x05-SI was used with
13 and 16 GHz amplifiers.

Now, these solder-in leads have been replaced with a universal Dxx05-SI used for all
bandwidths (13-25 GHz). This lead can also be used as a replacement for the D1x05-
SI and D2005-SI.

Teledyne LeCroy's solder-in probe lead uses resistors at the tip that are precisely pre-cut to the
correct length. This design provides the following advantages:

It locates the damping resistance of the probe tip as close to the DUT as possible.

It eliminates the need for long lengths of wire between the DUT and the damping resistor,
which impacts loading and frequency response. The resistors may still be spaced as desired to
connect to a wide variety of circuits.

It eliminates the need to precision cut and solder small lengths of wire to the end of the
solder-in lead, and then solder these wires to the DUT.

The damping resistors are easily replaced in the field to provide maximum serviceability and
life of the solder-in probe lead.