Teledyne LeCroy WaveLink Differential Probe Series (13-25 GHz) - Manual (Page 31)

Operator's Manual
WL-HBW-A-OM-E Rev B 25
P ROPER SI L EAD P OSITIONING
When wires are attached to a probe's tips or leads to make probing of the circuit under test easier
to perform, additional inductance and/or capacitance is added to the input, lowering the resonance
frequency of a series resonance circuit, which may cause oscillations with frequencies within the
passband of the probe. These effects, or excessive ringing, degrade the performance of the probe,
resulting in incorrect presentation of the input signal, reduced bandwidth, and changes in loading
impedance.
Measuring with SI Interconnect Lead
NOTE:

The entire SI tip should be positioned with the resistor side upright facing (away from the
PCB plane).

Keep a 45 degree angle between the SI tip ends and the PCB plane.