Teledyne LeCroy WaveLink Differential Probe Series (13-25 GHz) User Manual

Page 39

Operator's Manual

WL-HBW-A-OM-E Rev B

ASTENING THE

LIP TO THE

OARD

Fasten the clip to the board by removing the small piece of protection paper from one side of the
adhesive pad and mount the pad to the underside of the clip. If necessary, use alcohol to clean the
section of the board where the clip is mounted to remove any grease or flux residue.

Connecting the SI Module Using the Tip Retaining Clip

Remove the protective paper from the other side of the adhesive pad and mount the clip to the
desired location on the board. Apply pressure to the clip for at least several seconds to assure
proper adhesion (shown previous)

The adhesive pad with the tab is still visible and stays attached to the adhesive pad. The tab is used
to remove the clip from the board.

NOTE: Maximum strength of the adhesive pad is obtained after about 30 minutes.

OVING AND

OSITIONING

Always apply pressure to the pad (as follows) to prevent any shifting while bending the arms and/or
moving the probe adapter portion of the clip (typically done while positioning or attaching the
probe).

NOTE: This is especially important if moving and positioning before the adhesive pads have properly
cured.