Xilinx Virtex-5 FPGA ML561 - Manual (Page 38)

38 www.xilinx.com Virtex-5 FPGA ML561 User Guide
UG199 (v1.2.1) June 15, 2009
Chapter 3: Hardware Description R
Table 3-19 shows the details of the dielectric material and construction for each layer and
the controlled impedance values for the signal layers.
Table 3-19: ML561 Revision A PCB Controlled Impedance
Seq #
Layer
Name
Type Usage
Cu
Weight
(oz.)
Substrate
Thickness
(mils)
Er
Test
Width
(mils)
Z
0
(ohms)
Comment
1 TOP Metal Signal 1.0 6 50 ±5 Microstrip Signal Top
2 Dielectric Substrate 3.8 4.4
3 02_GND1 Metal Plane 1.0 Ground Plane #1
4 Dielectric Substrate 4 4.4
5 03_INR1 Metal Signal 0.5 4.5 50 ±5 Stripline Signal - Inner #1
6 Dielectric Substrate 5.3 4.4
7 04_PWR1 Metal Plane 1.0 Split Power Plane #1
8 Dielectric Substrate 8 4.4
9 05_INR2 Metal Signal 0.5 4.5 50 ±5 Stripline Signal - Inner #2
10 Dielectric Substrate 3.2 4.4
11 06_GND2 Metal Plane 1.0 Ground Plane #2
12 Dielectric Substrate 3 4.4
13 07_PWR2 Metal Plane 1.0 Split Power Plane #2
14 Dielectric Substrate 3.3 4.4
15 08_PWR3 Metal Plane 1.0 Split Power Plane #3
16 Dielectric Substrate 3 4.4
17 09_GND3 Metal Plane 1.0 Ground Plane #3
18 Dielectric Substrate 3.2 4.4
19 10_INR5 Metal Signal 0.5 4.5 50 ±5 Stripline Signal - Inner #3
20 Dielectric Substrate 8 4.4
21 11_PWR4 Metal Plane 1.0 Split Power Plane #4
22 Dielectric Substrate 5.3 4.4
23 12_INR6 Metal Signal 0.5 4.5 50 ±5 Stripline Signal - Inner #4
24 Dielectric Substrate 4 4.4
25 13_GND4 Metal Plane 1.0 Ground Plane #4
26 Dielectric Substrate 3.8 4.4
27 BOTTOM Metal Signal 1.0 6 50 ±5 Microstrip Signal Bottom