Grounding, Power, Cooling – H3C Technologies H3C S10500 Series Switches User Manual
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4
Gas
Maximum concentration (mg/m
3
)
NO
2
0.04
EMI
All electromagnetic interference (EMI) sources, from outside or inside of the switch and application
system, adversely affect the switch in the following ways:
•
A conduction pattern of capacitance coupling.
•
Inductance coupling.
•
Electromagnetic wave radiation.
•
Common impedance (including the grounding system) coupling.
To prevent EMI, perform the following tasks:
•
If AC power is used, use a single-phase three-wire power receptacle with protection earth (PE) to
filter interference from the power grid.
•
Keep the switch far away from radio transmitting stations, radar stations, and high-frequency
devices.
•
Use electromagnetic shielding, for example, shielded interface cables, when necessary.
Grounding
Using a good grounding system to protect your switch against lightning shocks, interferences, and ESD
is essential to the operating reliability of your switch.
Make sure the resistance between the chassis and the ground is less than 1 ohm.
Power
Perform the following tasks to meet the power requirements:
1.
Calculate the system power consumption.
The system power consumption varies by card type and density. PoE power consumption must be
included if the switch uses PoE to supply power to other devices. For more information about
system power consumption calculation, see "
Appendix A Chassis views and technical
2.
Select power modules and identify the number of power modules.
The total maximum output power of all power modules must be higher than the system power
consumption. For more information about available power modules, see "
3.
Verify that the power system at the installation site meets the requirements of the power modules,
including the input method and rated input voltage.
Cooling
Plan the installation site for adequate ventilation.
•
Leave a minimum of 10 cm (3.94 in) of clearance at the inlet and outlet air vents.