Elecraft K1 - Manual (Page 10)

E
LECRAFT 9
Identifying Capacitors
Small-value fixed capacitors are usually marked with one, two, or
three digits and no decimal point. If one or two digits are used, that
is the value in picofarads (pF). If there are three digits, the third
digit is a multiplier. For example, a capacitor marked "151" would
be 150 pF (15 with a multiplier of 10
1 ). Similarly, "330" would be
33 pF, and "102" would be 1000 pF (or .001 µF). Exceptions are
described specifically in the text and parts list.
Fixed capacitors with values of 1000 pF or higher often use a
decimal point in the value, such as .001, .047, or 2.2. This is the
value in microfarads (µF). (1 µF is equal to 1,000,000 pF.)
Tools
The following specialized tools are supplied with the K1:
.050" (1.3 mm) and 5/64" (2 mm) Allen wrenches
Double-ended plastic alignment tool
In addition to the tools supplied, you will need these standard tools:
Temperature-controlled soldering iron, 700-800°F (370-430°C)
Fine-point soldering iron tip, approx. .05" (spade type)
Small-diameter, IC-grade solder (see Solder Recommendations)
Desoldering tools (wick, solder-sucker, etc.)
Needle-nose pliers
Small-point diagonal cutters, preferably flush-cutting
Small Phillips and flat-blade screwdrivers
DMM (digital multimeter; do not use an analog VOM)
Magnifying glass
We strongly recommend that you use a conductive wrist strap and
anti-static mat during assembly. These items are available at very
low cost from Jameco, Mouser, and other electronics suppliers.
Soldering and Desoldering
Use adequate ventilation when soldering, and avoid
inhaling smoke or fumes. Always wash your hands after
handling solder, as lead residue is highly toxic.
Solder Recommendations
We recommend small-diameter (.02 to .04") rosin-core solder,
similar to Kester type 44. Solder with 2% silver is used by some
builders and will work equally well. If you use a minimum of solder,
there will be no need to clean PC boards. The use of acid-core
solder, water-soluble flux solder, or any corrosive or conductive flux
or solvent is likely to damage components and/or PC boards.
Soldering
When applying solder, use the minimum amount required to
surround the component lead and make good contact with its
printed-circuit pad. You don't need a "fillet" (build-up) of solder.
To provide a good connection, the solder must flow onto both the
component lead and its PC board pad. To ensure that both will be
heated at the same time, the tip of the iron should contact both the
component lead and the PC board pad before solder is applied.
Solder joints should be clean and shiny. If a joint appears dull or has
fine cracks, it is probably cold. Cold solder joints should be cleaned
and re-soldered. First, use solder wick (desoldering braid) to remove
the old solder. Then apply fresh solder. If you have many cold
solder joints, it probably indicates that your soldering iron
temperature is too low, or that the tip or solder itself is defective.
New soldering iron tips must be tinned before they’re used. Allow
the iron to warm up completely, then apply solder and allow it to
coat the entire tip. After a few minutes, wipe off the excess solder.
Use a sponge for wiping the iron tip, and clean the sponge often.