Agilent Technologies HDMP-3001 - Manual (Page 105)

105
Figure 26. Bottom View of Package
Figure 27. Side View of Package
Figure 28. Detailed View of Pin
12
2
H
L
BASE PLANE
A1
A2
DETAIL "B"
0 - 7 °
C
C
0.25
GAGE
PLANE
R 0.13/0.30
0 ° MIN.
0.40 MIN.
0.13 R
MIN.
1.60 REF.
11
11
9
10
10
11 10
11
10
b
b 1
BASE METAL
SECTION C-C
WITH LEAD FINISH
0.11/0.19 0.11/0.23
DATUM
PLANE
SEATING
PLANE
E1
E2 5
11.0 REF.
11.0 REF.
D2
D1
D1
2
COUNTRY OF
ORIGIN MARK
3.00 REF. DIA.
4 PLACES
BOTTOM VIEW
5
NOTES
1 ALL DIMENSIONS AND TOLERANCES CONFORM TO
ANSI Y145H-1982
2 THE TOP PACKAGE BODY SIZE MAY BE SMALLER THAN
THE BOTTOM PACKAGE BODY SIZE
3 DATUMS A-B AND D TO BE DETERMINED AT DATUM
PLANE H
4 TO BE DETERMINED AT SEATING PLANE C
5 DIMENSION D1 AND E1 DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.152 mm
PER SIDE. D1 AND E1 ARE MAXIMUM PLASTIC BODY
SIZE DIMENSIONS INCLUDING MOLD MISMATCH.
DIMENSIONS D1 AND E1 SHALL BE DETERMINED AT
DATUM PLANE H .
6 DETAILS OF PIN 1 IDENTIFIER ARE OPTIONAL, BUT MUST
BE LOCATED WITHIN THE ZONE INDICATED.
7 EXACT SHAPE AT EACH CORNER IS OPTIONAL.
8 MEASURED AT GAGE PLANE.
9 DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION, ALLOWABLE PROTRUSION SHALL BE
0.08 mm TOTAL IN EXCESS OF THE b DIMENSION AT
MAXIMUM MATERIAL CONDITION . DAMBAR MAY NOT
BE LOCATED AT THE LOWER RADIUS OF THE FOOT. THE
MINIMUM SPACING BETWEEN PROTRUSION AND AN
ADJACENT LEAD SHALL NOT BE LESS THAN 0.07 mm.
10 PLATING THICKNESS 0.007 MIN. TO 0.020 MAX. SOLDER
PLATE 855n/ISPO.
11 THESE DIMENSIONS APPLY TO THE FLAT SECTION OF
THE LEAD BETWEEN 0.10 mm AND 0.25 mm FROM THE
LEAD TIP.
12 A1 IS DEFINED AS THE DISTANCE FROM THE SEATING
PLANE TO THE LOWEST POINT OF THE PACKAGE BODY.
E1
2
2 e
C
12 ° - 16 °
SEE DETAIL "B"
A
b
SEATING
PLANE
C
H DATUM PLANE
ccc