IEI Integration WAFER-LX v1.0 - Manual (Page 56)

WAFER-LX
Airflow Consideration
Although the embedded board can operate without active cooling, it is still necessary to install the
board in a chassis with ventilation holes on the sides allowing airflow to travel through the heatsink
surface. In a system with an individual power supply unit, the cooling fan of a power supply can
also help generate airflow through the board surface.
Unpacking Precautions
Some components on the WAFER-LX are very sensitive to static electric charges and can be
damaged by a sudden rush of power. To protect it from unintended damage, be sure to follow
these precautions:
Ground yourself to remove any static charge before touching your PCB. You can do
so by using a grounded wrist strap at all times or by frequently touching any
conducting materials that is connected to the ground.
Handle your PCB by its edges. Do not touch IC chips, leads or circuitry if not
necessary.
Do not plug or unplug any connector or jumper while the power is on.
Do not place a PCB on top of an anti-static bag. Only the inside of the bag is safe
from static discharge.
Memory Module
DDR 333/400, 256MB, 512MB, or 1GB, 144-pin SODIMM modules recommended.
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