IEI Integration WAFER-LX v1.0 - Manual (Page 23)

WAFER-LX User Manual
This chapter provides a functional description of the WAFER-LX embedded board designed for the
integration into a compact size chassis. This chapter includes information about main processors,
interface connectors, implementation options, and signal description.
2.1 CPU, Memory, and VIA Chipsets
CPU
The WAFER-LX comes with a soldered low power AMD Geode LX-800 processor. The AMD
Geode design integrates high-performance graphics controller, VGA and Flat Panel display
interfaces, with the burst and concurrent GeodeLink pipelining capability for fast data distribution
among CPU, DRAM, and PCI buses. CPU and the major functionalities are provided in a single
processor package. The CPU is accompanied by the Geode CS5536AD Southbridge featuring
full-featured interfaces with integrated UltraDMA-66/100 IDE, USB, and a complete power
management feature set. The CS5536AD also provides hardware monitoring and super I/O
functions (floppy disk drive and serial/parallel ports).
The CPU is passively cooled over a heatsink made in aluminum alloy and is ideal for small form
factor computing applications with its low power consumption and minimum heat dissipation.
Shown below are some of the key features of the AMD Geode LX processor:
x86/x87 compatible core.
LX-800 with a processor frequency up to 500MHz.
64K I/64K D L1 cache & 128K L2 cache.
Split I/D cache / TLB (Translation Look-aside Buffer).
64-bit DDR memory up to 400MHz (LX 800).
Integrated FPU that supports the Intel MMX and AMD 3DNow! Technology instruction
sets.
9GB/s internal GeodeLink Interface Unit (GLIU).
High-resolution CRT and TFT outputs (simultaneous operation)
Support for High Definition (HD) and standard Definition (SD) standards.
0.13 micron process.
1.3W Typical (3.1W TDP) @ 433MHz.
GeodeLink active hardware power management.
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