IEI Integration WAFER-LX v1.0 - Manual (Page 141)

WAFER-LX
CN5, 2-13
CN6, 2-14
CN7, 2-14
CN8, 2-14
CN9, 2-15
coin cell, 2-9
COM1, 1-4, 2-10, 2-32
COM1 and COM2 Port Power Selector,
3-7
COM1(CN22), 3-10
COM2, 1-4, 2-10, 2-22
Compact flash, 1-5, 2-10
Compact Flash, 2-30
Compact Flash Disk, 1-9, 3-9
configuration jumpers, 2-8
Configuration Jumpers, 3-5
CPU, 1-9, 2-2
CPU fan, 1-4, 2-9
CPU Feature, 4-17
CPU Frequency, 4-17
CRT VGA, 3-10
CS5536AD, 2-2
Ｄ
Digital I/O, 2-19
Display Controller, 1-9
DOS environment, A-2
DRAM Latency Timing, 4-20
DRAM RAS# Precharge, 4-21
DRAM RAS# to CAS# Delay, 4-21
DVMT Mode, 4-25
Ｅ
ECP Mode Use DMA, 4-30
EEPROM, 1-10
electrostatic discharge, 3-2
ESD, 3-2
Ethernet, 3-11
Ethernet interface, 1-9
Ethernet port, 1-4, 2-10
Ethernet Port LED, 2-32
external interfaces, 2-7
External LED, 1-4
external VCC, 1-4
external -VCC, 2-9
External –VCC Power, 2-18
Ｆ
failed drive, C-2
Fan Connector, 2-13
FDD, 4-13, 4-37
FDD Interface, 1-9
Flat Panel Configuration, 4-18
Flat panel display, 3-10
Flat Panel Display, 2-26
floppy, 1-5, 2-10
Floppy, 2-29, 3-9
Form Factors, 1-10
FPC connector, 2-29
Front Panel, 2-31
Ｇ
Game Port Address, 4-43
Gate A20 Option, 4-15
general purpose I/Os, 1-4, 2-9
Geode, 1-5, 2-5
Geode LX800 processor, 1-2
Ｈ
Hard Disk Boot Priority, 4-19
Hard Disk Drives, 3-8
Hardware monitor, 1-10
Hardware Monitor, 2-5
HDD, 4-8, 4-9, 4-10, 4-13, 4-28, 4-29,
4-34
heatsink, 1-5, 2-2
Humidity, 2-6
I-3