IEI Integration WAFER-LX v1.0 - Manual (Page 15)

WAFER-LX
CN26 D-SUB 15-pin VGA connector
CN27 5-pin IrDA connector
CN28 24-bit TFT LCD connector (DF13-40P-1.25V)
CN29 LCD panel single-channel 18-bit LVDS/TTL connector, 20 (2x10) pin
header 1.25mm (DF13-20P-1.25V)
CN30 Primary IDE bus connector (44-pin 2.0mm)
CN31 FDC flat type floppy port (one floppy drive only)
CN32 Compact flash storage card socket
The WAFER-LX is built around an AMD Geode™ chipset which features highest
performance per watt, an embedded graphics controller, and full set of functionality
through the companion Geode CS5536 Southbridge. The WAFER-LX enables
simultaneous dual-display operations by the 32-bit processing power, the 9GB/s
bandwidth GeodeLink internal links, and the integrated FPUs operating enhanced
Intel MMX and 3Dnow! technologies.
The built-in graphics controller supports both a CRT and an 18-bit LCD display
simultaneously. It offers the resolutions of LCD screen up to 1920 x 1440 (CRT),
and 1620 x 1200 (TFT) pixels, with 18-bit DSTN/TFT flat panel interface. The
WAFER-LX’s high efficiency design enables its use in a variety of multimedia
applications combining the powerful Geode x86 engine, application-specific
system-level peripherals, multi-input video processor, video input/output ports, core
logic, and a Super I/O block. In addition, the architecture features advanced
display interface support for audio, AC’97, and AMC97.
Other distinguished features include: PCI extension bus, USB interface, power
management ACPI 1.0 compliance, long-term support, and built-in OS integration.
With a specially designed aluminum heatsink, this board can operate without a
cooling fan at temperatures up to 60° C (140°F) and typically consumes low power
watts while supporting numerous peripherals.
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