Texas Instruments MSP50C614 - Manual (Page 387)

Mechanical Information
7-5 Customer Information
The C614 is sold in die form for its volume production. For software develop-
ment and prototyping, a windowed ceramic 120 pin grid array packaged P614
is available. The P614’s PGA package is shown in Figure 7–2.
Figure 7–2. 120-Pin Grid Array Package for the Development Device, P614
extra pin
1 2 3 4 5 6 7 8 9
N
M
L
K
J
H
G
F
E
D
C
B
A
10 9 8 7 6 5 4 3 2 1
N
M
L
K
J
H
G
F
E
D
C
B
A
(BOTTOM VIEW) (TOP VIEW)
11 12 13 11 12 13 10
Note:
The PGA package is only available in limited quantities for development
purposes.