Rockwell Automation 1747-L5xx SLC 500 Modular Hardware Style User Manual - Manual (Page 175)

175 Publication 1747-UM011G-EN-P - June 2008
Appendix
A
Specifications
This appendix provides the specifications for the SLC 500 processors as well
as the SLC power supplies.
SLC 500 System General
Specifications The table below lists SLC 500 system test specifications.
Attribute Value Industry Standard
Temperature, operating 0 °C...60 °C (32 °F...140 °F) Not applicable
Temperature, storage -40 °C...85°C (-40 °F...185 °F) Not applicable
Humidity 5 to 95% without condensation Not applicable
Vibration, operating 2.5 g at 5...2000 Hz Not applicable
Vibration, non-operating 5 g at 5...2000 Hz Not applicable
Shock, operating all modules except relay contact
30.0 g (3 pulses, 11 ms)
Not applicable
Shock, operating relay contact modules - OW, OX, IO combo
10.0 g (3 pulses, 11 ms)
Not applicable
Shock, non-operating 50.0 g (3 pulses, 11 ms) Not applicable
Free fall (drop test) Portable, 2.268 kg (5 lb) or less at 0.762 m (30 in.)
(six drops)
Not applicable
Portable, 2.268 kg (5 lb) or more at 0.1016 m (4 in.) (three
flat drops)
Not applicable
Safety Dielectric withstand: 1500V ac UL 508, CSA C22.2 No. 142
Isolation between communication circuits: 500V dc Not applicable
Isolation between backplane and I/Os: 1500V ac Not applicable
Flammability and electrical ignition: UL94V-0 Not applicable
Certification UL listed to US and Canadian Safety Standards
Class I, Groups A, B, C or D, Division 2
CE compliant for all applicable directives
C-Tick marked for all applicable acts
Not applicable