Intel CHIPSET 820E - Manual (Page 11)

Intel ® 820E Chipset
R
Design Guide 11
Table 45. USB........................................................................................................................ 134
Table 46. LAN Connect I/F..................................................................................................... 135
Table 47. AC’97 ..................................................................................................................... 136
Table 48. ICH2 Decoupling .................................................................................................... 136
Table 49. CK-SKS Clocking................................................................................................... 137
Table 50. RTC........................................................................................................................ 137
Table 51. AGTL+ Parameters for Example Calculations 1,2 .................................................... 143
Table 52. Example T
FLT_MAX
Calculations for 133 MHz Bus 1 .................................................. 144
Table 53. Example T
FLT_MIN
Calculations 1 (Frequency Independent)..................................... 145
Table 54. Trace Width Space Guidelines .............................................................................. 148
Table 55. Intel ® 820E Chipset Platform System Clocks......................................................... 163
Table 56. Intel ® 820E Chipset Platform Clock Skews ............................................................ 165
Table 57. Intel ® 820E Chipset Platform System Clock Cross-Reference .............................. 167
Table 58. Placement Guidelines for Motherboard Routing Lengths (Direct RDRAM*
Clock Routing Length Guidelines) .......................................................................... 170
Table 59. External DRCG Component Values....................................................................... 172
Table 60. Unused Output Termination................................................................................... 174
Table 61. 28 Ω Stack-Up Examples....................................................................................... 179
Table 62. 3D Field Solver vs. ZCALC .................................................................................... 180
Table 63. Intel ® 820E Chipset Component Thermal Design Power....................................... 193
Table 64. Glue Chip Vendors................................................................................................. 194