beautypg.com

Technical specifications, Iqs-2400 – EXFO IQS-2400 WDM Laser Source for IQS-500/600 User Manual

Page 84

background image

Technical Specifications

78

IQS-2400

SPECIFICATIONS

a

FTB-85102 FTB-8510-12

FTB-8510-2

Ports Gigabit Ethernet

Two 10/100Base-T

Two 10/100Base-T

Two 10/100Base-T and two

and one Gigabit Ethernet

Connector types

RJ-45 (ISO 8877)

RJ-45 (ISO 8877) and LC

RJ-45 (ISO 8877) and LC

Connect speed (Mb/s)

10/100

10/100/1000

10/100/1000

Duplex mode

Full/half-duplex

Full/half-duplex

Full/half-duplex

auto-negotiation auto-negotiation

auto-negotiation

Maximum port capacity (Mb/s)

200 (bidirectional)

2000 (bidirectional)

2000 (bidirectional)

Ethernet testing

RFC 2544

RFC 2544

RFC 2544

RFC 1242

RFC 1242

RFC 1242

Size (H x W x D)

125 mm x 36 mm x 282 mm

4

15/16

in x 1

7/16

in x 11

1/8

in

Weight

0.580 kg

1.25 lb

Temperature

Operating

10 °C to 40 °C

50 °F to 104 °F

Storage

—40 °C to 70 °C

—40 °F to 158 °F

Relative humidity

0 to 95 % non-condensing

Instruments Drivers

LabVIEW™ drivers, SCPI commands and COM/DCOM libraries

Remote Control

With IQS-500: GPIB (IEEE-488.1, IEEE-488.2) Ethernet and RS-232.

Standard Accessories

User guide, test report and Certificate of Compliance.

SPECIFICATIONS

a

FTB-85102 FTB-8510-12

FTB-8510-2

Ports Gigabit Ethernet

Two 10/100Base-T

Two 10/100Base-T

Two 10/100Base-T and two

and one Gigabit Ethernet

Connector types

RJ-45 (ISO 8877)

RJ-45 (ISO 8877) and LC

RJ-45 (ISO 8877) and LC

Connect speed (Mb/s)

10/100

10/100/1000

10/100/1000

Duplex mode

Full/half-duplex

Full/half-duplex

Full/half-duplex

auto-negotiation auto-negotiation

auto-negotiation

Maximum port capacity (Mb/s)

200 (bidirectional)

2000 (bidirectional)

2000 (bidirectional)

Ethernet testing

RFC 2544

RFC 2544

RFC 2544

RFC 1242

RFC 1242

RFC 1242

IQS-2404 SPECIFICATIONS

Model

P4/P5

P6/P7

Wavelength band

L-band

L-band

1566 nm to 1606 nm

1566 nm to 1606 nm

Wavelength tuning range

a

(nm)

±1

±1

Wavelength tuning resolution

b

(nm)

0.01 0.01

Wavelength accuracy

c, d

(nm)

±0.01 ±0.02

Wavelength stability

d, e

(nm)

±0.002

±0.002

Output power

f

(dBm)

10

13

Output power attenuation range (dB)

10

10

Sidemode suppression

g

(dB)

30 (40 typical)

30 (40 typical)

Output power uncertainty

c

(dB)

±0.3

±0.3

Power stability

c, d

(dB)

15 min

±0.005 (

Δ= 0.01)

±0.005 (

Δ= 0.01)

8 h

±0.03 (

Δ= 0.06)

±0.03 (

Δ= 0.06)

Modulation frequency (internal or external sync.) (kHz)

0.010 to 300

0.010 to 300

Dithered modulation amplitude range

h

(mA)

1 to 5

1 to 5

Dithered modulation electrical waveform

Square/triangular

Square/triangular

Notes

a. Guaranteed if the ambient temperature stays between 15 °C to 30 °C.

b. In high-wavelength stability mode, better resolution is possible, but on a limited range.

c. Specified at 23 °C ± 1 °C with 50 % relative humidity.

d. After a 1-hour warmup period.

e. For 8 hours at 23 °C ± 1 °C with 50 % relative humidity.

f. Output power is specified at connector output.

g. Guaranteed at maximum power level.

h. Dithered modulation is only available internally at a typical duty cycle of 50 % duty cycle.

GENERAL SPECIFICATIONS