Rockwell Automation 1440-TTC06-00RE XM-362 Temperature Module - Manual (Page 73)

65 Publication GMSI10-UM008D-EN-P - August 2010
Appendix
A
Specifications
Appendix A lists the technical specifications for the XM-361/362
Temperature modules.
XM-361/362 Technical Specifications
Product Feature Specification
Communications
DeviceNet
Side Connector
Serial
Standard DeviceNet protocol for all
functions
NOTE: The XM-361/362 use only the DeviceNet
protocol, not power. Module power is provided
independently.
Available Electronic Data Sheet (EDS) file
provides support for most DeviceNet
compliant systems
Baud rate automatically set by bus master
to 125 kb, 250 kb, 500 kb
Configurable I/O Poll Response message
helps optimize space utilization within
scanner input tables.
Selectable Poll Response Assembly
Selectable Poll Response Size
(bytes)
All XM measurement and relay modules
include side connectors that allow
interconnecting adjacent modules, thereby
simplifying the external wiring
requirements.
The interconnect provides primary power,
DeviceNet communications, and the circuits
necessary to support expansion modules,
such as the XM-441 Expansion Relay
module.
RS-232 via mini-connector
Baud rate fixed at 19200
NOTE: Local configuration via Serial
Configuration Utility.