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Lenovo 3797 User Manual

Page 109

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4.

Depending

on

which

microprocessor

you

are

removing,

remove

the

following

components,

if

necessary:

v

Microprocessor

1:

PCI

riser-card

assembly

1

and

DIMM

air

baffle

(see

“Removing

a

PCI

riser-card

assembly”

on

page

42

and

“Removing

the

DIMM

air

baffle”

on

page

52)

v

Microprocessor

2:

PCI

riser-card

assembly

2

and

microprocessor

2

air

baffle

(see

“Removing

a

PCI

riser-card

assembly”

on

page

42

and

“Removing

the

microprocessor

2

air

baffle”

on

page

50).

5.

Open

the

heat-sink

release

lever

to

the

fully

open

position.

1

Heat-sink

release

lever

2

Microprocessor

3

Retainer

bracket

4

Lock

tab

6.

Lift

the

heat

sink

out

of

the

server.

If

the

heat

sink

sticks

to

the

microprocessor,

slightly

twist

the

heat

sink

back

and

forth

to

break

the

seal.

After

removal,

place

the

heat

sink

on

its

side

on

a

clean,

flat

surface.

7.

Release

the

microprocessor

retention

latch

1

by

pressing

down

on

the

end,

moving

it

to

the

side,

and

releasing

it

to

the

open

(up)

position.

8.

Open

the

microprocessor

bracket

frame

4

by

lifting

up

the

tab

on

the

top

edge.

Keep

the

bracket

frame

in

the

open

position.

9.

Carefully

lift

the

microprocessor

2

straight

up

and

out

of

the

socket,

and

place

it

on

a

static-protective

surface.

10.

If

you

are

instructed

to

return

the

microprocessor,

follow

all

packaging

instructions,

and

use

any

packaging

materials

for

shipping

that

are

supplied

to

you.

Chapter

5.

Installing

optional

devices

and

replacing

customer

replaceable

units

93

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