Artesyn MVME6100 Single Board Computer Installation and Use (June 2014) - Manual (Page 111)

Thermal Validation
MVME6100 Single Board Computer Installation and Use (6806800D58H) 111
B.3.1 Preparation
We recommend 40 AWG (American wire gauge) thermocouples for all thermal measurements.
Larger gauge thermocouples can wick heat away from the components and disturb air flowing
past the board.
Allow the board to reach thermal equilibrium before taking measurements. Most circuit boards
will reach thermal equilibrium within 30 minutes. After the warm up period, monitor a small
number of components over time to assure that equilibrium has been reached.
B.3.2 Measuring Junction Temperature
Some components have an on-chip thermal measuring device such as a thermal diode. For
instructions on measuring temperatures using the on-board device, refer to the component
manufacturer’s documentation listed in
Appendix A, Specifications .
B.3.3 Measuring Case Temperature
Measure the case temperature at the center of the top of the component. Make sure there is
good thermal contact between the thermocouple junction and the component. We
recommend you use a thermally conductive adhesive such as Loctite 384.
If components are covered by mechanical parts such as heatsinks, you will need to machine
these parts to route the thermocouple wire. Make sure that the thermocouple junction
contacts only the electrical component. Also make sure that heatsinks lay flat on electrical
components. The following figure shows one method of machining a heatsink base to provide
a thermocouple routing path.