Artesyn Centellis 2000 Shelf Release 3.0 Installation and Use (May 2014) - Manual (Page 62)

System Overview
Centellis 2000 Shelf Release 3.0 Installation and Use (6806800L99G) 62
This system contains boards with embedded power sources rated greater than 150 W.
To support NEBS compliance (Telcordia GR-1089-CORE, section 9.8.2, requirement R9-14),
shelf ground (chassis ground) and logic ground (logic signal return) are connected to the shelf
at the backplane with a screw assembled for that purpose. This screw is assembled in the upper
part of the RTM slot on the backplane near the RTM alignment pin. The screw may be removed
according to field requirements. However, if removed EMC compliance would be up to the
user.
For more information please refer to Telcordia GR-1089-CORE, section 9.8.2, requirement R9-14.
In the AdvancedTCA Specification the connection of shelf ground to logic ground is described as
an option.
The products listed in the ordering information for spare parts and accessory kits are
designed to meet the Directive on the restriction of the use of certain hazardous substances
in electrical and electronic equipment (RoHS), DIRECTIVE 2011/65/EU.
The system is compliant to NEBS and ETSI acoustic noise emission standards, if the system is
equipped with Artesyn blades and with properly designed and configured third party blades.
In a system thus configured, the fans will settle at approximately 10%-20% speed at an
ambient temperature of 23 ºC (+/- 2º C) (73.4 °F +/- 3.6 °F) under normal operating conditions.
To fulfill the requirements of Telcordia GR-1089,R4-14, use Shielded Twisted Pair (STP) cables
grounded at both ends to connect to the Ethernet ports.
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