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Micromod MOD: 30ML Installation User Manual

Page 30

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MOD 30ML Multiloop Controller

MECHANICAL INSTALLATION

24

Table 2-1. Module Types and Valid Locations

Module Type

Data Base

Block Type

Module

Width

Module Location

2001A Voltage Input
2002A Current Input

VCIM Single Any

Location

2012A Current Input with 2-Wire Transmitter

VCIM

Single

(Note 4)

2003A Current Output

AOM

Single

(Note 4)

2004A Solid State Relay Input

DIM

Single

S1 through S6

(Note 1)

2005A Solid State Relay Output

DOM

Single

S1 through S6

(Note 1)

2006A Nonisolated Digital Input

DIM

Single

Any Location

2007A Nonisolated Digital Output

DOM

Single

Any location

2009A RTD Input (2 Wire)

RIM

Single

Any Location

2009A RTD Input (3 Wire)

WRIM

Double

Any pair of Locations

2011A Mechanical Relay Output (SPST)
2011A Mechanical Relay Output (Form C)

DDOM

WDOM

Double

S1 & S2, S3 & S4,or

S5 & S6(Note 2)

2013A Thermocouple Input
with Upscale Burnout Detection

TIM Single Any

Location

2020N Remote I/O Interface Module (discontinued)

RIO

Double

Any Pair of Locations

2030N ICN Communication

ICN

Double

S7&S8 (Port 2)

or

S9&S10 (Port 1)

(Note 3)

2032N RS-485 2-Wire Modbus Communication
(discontinued)

MSC

Single

S8 (Port 2) or

S10 (Port 1)

(Note 3)

2033N RS-232 Modbus Communication
2034N RS-485 4-Wire Modbus Communication

MSC

Double

S7 & S8 (Port 2)

or

S9 & S10 (Port 1)

(Note 3)

* NOTES: 1. The maximum working voltage between adjacent terminal of circuits

rated less than 30 V rms or 42.4 V peak or 60 Vdc must not be more
than 150 V. The maximum working voltage between adjacent terminal of
circuits rated greater than 30 V rms or 42.4 V peak or 60 Vdc must not
be more than 300 V.

2. If I/O circuit voltage is 30V rms, 42.4V peak, 60V dc or less, location

pairs S7-S8 and S9-S10 can also be used.

3. If a communications module is installed in location S10, built-in

communication drivers are not available.

4. Though 2003A and 2012A modules can be installed in any location,

special attention should be given to ensure adequate air flow for heat
dissipation. Refer to the I/O Module Planning section of this manual for
details.