NXP Semiconductors PCA9665 - Manual (Page 86)

PCA9665_2 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 7 December 2006 86 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I 2 C-bus controller
[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your NXP
Semiconductors sales office.
[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with
respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of
the moisture in them (the so called popcorn effect).
[3] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
[4] Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed
through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217
° C ± 10 ° C
measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[6] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate
between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the
heatsink surface.
[7] If wave soldering is considered, then the package must be placed at a 45 ° angle to the solder wave direction. The package footprint
must incorporate solder thieves downstream and at the side corners.
[8] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.65 mm.
[9] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely
not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil.
However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate
soldering profile can be provided on request.
Surface mount BGA, HTSSON..T [5] , LBGA,
LFBGA, SQFP, SSOP..T [5] , TFBGA,
VFBGA, XSON
not suitable suitable −
DHVQFN, HBCC, HBGA, HLQFP,
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS not suitable [6] suitable −
PLCC [7] , SO, SOJ suitable suitable −
LQFP, QFP, TQFP not recommended [7][8] suitable −
SSOP, TSSOP, VSO, VSSOP not recommended [9] suitable −
CWQCCN..L [10] , WQCCN..L [10] not suitable not suitable −
Table 56. Suitability of IC packages for wave, reflow and dipping soldering methods …continued
Mounting Package [1] Soldering method
Wave Reflow [2] Dipping