Package outline, Pca9665, Nxp semiconductors – NXP Semiconductors PCA9665 User Manual
Page 79: Fm+ parallel bus to i, C-bus controller
PCA9665_2
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 7 December 2006
79 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I
2
C-bus controller
15. Package outline
Fig 45. Package outline SOT146-1 (DIP20)
UNIT
A
max.
1
2
b
1
c
D
E
e
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1
99-12-27
03-02-13
A
min.
A
max.
b
Z
max.
w
M
E
e
1
1.73
1.30
0.53
0.38
0.36
0.23
26.92
26.54
6.40
6.22
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
2
4.2
0.51
3.2
0.068
0.051
0.021
0.015
0.014
0.009
1.060
1.045
0.25
0.24
0.14
0.12
0.01
0.1
0.3
0.32
0.31
0.39
0.33
0.078
0.17
0.02
0.13
SC-603
MS-001
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
20
1
11
10
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1)
(1)
DIP20: plastic dual in-line package; 20 leads (300 mil)
SOT146-1