NXP Semiconductors PCA9665 - Manual (Page 84)

PCA9665_2 © NXP B.V. 2006. All rights reserved.
Product data sheet Rev. 02 — 7 December 2006 84 of 91
NXP Semiconductors
PCA9665
Fm+ parallel bus to I 2 C-bus controller
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 54 and 55
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 49 .
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 54. SnPb eutectic process (from J-STD-020C)
Package thickness (mm) Package reflow temperature ( ° C)
Volume (mm 3 )
< 350 ≥ 350
< 2.5 235 220
≥ 2.5 220 220
Table 55. Lead-free process (from J-STD-020C)
Package thickness (mm) Package reflow temperature ( ° C)
Volume (mm 3 )
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
MSL: Moisture Sensitivity Level
Fig 49. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature