LINK Systems OmniLink II Press Automation Control - Manual (Page 108)

August 30, 2002 Manual Version 1.0 6.3
PARAMETER SPECIFICATION
Enclosure Dimensions
11.9” (302 mm) High x 6.25” (159 mm) Wide x 4” (102 mm) Deep
Mounting Footprint 11.15” (283 mm) High x 4.25” (108 mm) Wide
Maximum Overall
Clearance Dimensions 17” (432 mm) High x 6.25” (159 mm) Wide x 8” (203 mm) Deep
Input Power 100 to 135 VAC @ .5 Amps (Voltage Selector in 115 position) or
200 to 270 VAC @ .25 Amps(Voltage Selector in 230 position)
Input Fuse Type 95 to 140 VAC operation Littlefuse 313.500, Bussman MDL-1/2, Gould
GLD-1/2 or equivalent
190 to 280 VAC operation Littlefuse 313.250, Bussman MDL-1/4, Gould
GLD-1/4 or equivalent
Sensor Types 3 Wire DC, NPN or PNP
with no LED in parallel with the load
Available Sensor Power 24 VDC @ 1 Amp maximum (total for all sensors)
Sensor Voltage Drop 4 VDC maximum across switch in ON (closed) state
Sensor Leakage Current 500 uA maximum in OFF (non-conducting) state
Front Panel Micro-
Connector (optional) Mating Connectors Link Part # 108046 Connector Straight
Link Part # 108048 Connector Right Angle
Binding Post (optional) Mating Connector Link Part # 100377 – White Banana Plug
Quick Die Change
Receptacle (optional) Mating Cordset Link Part # 108776 – 2 Meter Length
Link Part # 108777 – 3 Meter Length
Link Part # 108778 – 5 Meter Length
Table 6.2 Specifications
Section 6.3 Mounting
The Digital Die Protection and Process Monitor is designed to be mounted in close proximity to the
tooling. The unit should be mounted in a location that allows the front panel indicators to be viewed and
easy access to the front panel receptacles and to the quick die change receptacle. The enclosure
dimensions and mounting footprint are shown on Figure 6.1. The unit shown in Figure 6.1 has both the
door mounted binding posts and micro connectors, and the bottom mounted 19 pin connector. Some
models of the Digital Die Protection and Process Monitor do not have the door mounted binding posts
and micro connectors. Some models do not have the bottom mounted 19 pin connector. The absence of
these items will decrease the mounting clearance requirements.
Normally the Digital Die Protection and Process Monitor module can be mounted directly to the press
frame. However in high shock and vibration environments, shock mounts may be required. If it is
determined that shock mounts are required, please consult Link Systems for recommendations.