HP OneView for Red Hat Enterprise Virtualization - Manual (Page 23)

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Power Consumed—Current power consumed by the subsystem.
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Good Power Supplies—Number of power supplies that are currently operating in the subsystem.
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Wanted Power Supplies—Needed number of power supplies plus the redundant number of
power supplies in the subsystem.
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Needed Power Supplies—Number of power supplies needed for the subsystem to work properly.
Thermal Information
The Thermal Information table contains:
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Redundancy—Status of thermal subsystem redundancy: either in a redundant configuration,
not in a redundant configuration, or status unknown.
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Ambient Temperature—Temperature inside the enclosure.
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Good Fans—Number of fans currently operating in the enclosure.
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Wanted Fans—Needed number of fans plus the redundant number of fans.
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Needed Fans—Number of fans required for the subsystem not to overheat.
Fan Information
The Fan Information table contains, for each fan bay:
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Bay—Location of the fan.
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Status—Current status of the fan.
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Name—HP product name of the fan.
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Speed—Fan speed for thermal management of server.
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Power—Amount of power currently being consumed by the fan.
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Part Number—HP fan part number.
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Spare Part Number—HP fan spare part number.
Power Supplies
The Power Supplies table contains, for each power supply bay:
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Bay—Location of the power supply.
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Status—Current status of the power supply.
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Name—HP product name of the power supply.
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Power—Amount of power currently supplied and the total amount of power that can be
supplied.
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Serial Number—HP serial number for the power supply.
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Part Number—HP part number for the power supply.
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Spare Part Number—HP spare part number for the power supply.
Interconnect Trays
The Interconnect Trays table contains, for each interconnect tray:
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Bay—Bay number containing the interconnect tray.
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Status—Current status of the enclosure tray.
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Name—HP product name of the interconnect module.
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Power—Amount of power currently being used by the interconnect module.
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Serial Number—HP module serial number.
Enclosure 23