IEI Integration ECW-281B_D2550 - Manual (Page 5)

ECW-281B-D2550 Embedded System
Page v
Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 O VERVIEW .................................................................................................................. 2
1.2 M ODEL V ARIATIONS ................................................................................................... 2
1.3 F EATURES ................................................................................................................... 3
1.4 E XTERNAL O VERVIEW ................................................................................................ 3
1.4.1 Front Panel ........................................................................................................ 3
1.4.2 Rear Panel ......................................................................................................... 4
1.4.3 Bottom Surface................................................................................................... 5
1.5 I NTERNAL O VERVIEW ................................................................................................. 6
1.6 T ECHNICAL S PECIFICATIONS ...................................................................................... 6
1.7 P OWER M ODULE S PECIFICATIONS (O PTIONAL ) .......................................................... 8
1.8 P OWER A DAPTER (O PTIONAL ) ................................................................................... 9
1.9 D IMENSIONS ............................................................................................................. 10
2 UNPACKING ................................................................................................................11
2.1 A NTI - STATIC P RECAUTIONS ...................................................................................... 12
2.2 U NPACKING P RECAUTIONS ....................................................................................... 12
2.3 U NPACKING C HECKLIST ........................................................................................... 13
3 INSTALLATION ......................................................................................................... 15
3.1 I NSTALLATION P RECAUTIONS ................................................................................... 16
3.2 B OTTOM S URFACE R EMOVAL ................................................................................... 16
3.3 H ARD D RIVE I NSTALLATION ..................................................................................... 17
3.4 F ULL - SIZE PCI E M INI C ARD I NSTALLATION ............................................................. 20
3.5 H ALF - SIZE PCI E M INI C ARD I NSTALLATION ............................................................. 22
3.6 J UMPER S ETTINGS .................................................................................................... 24
3.6.1 AT/ATX Power Selection Jumper ..................................................................... 25
3.6.2 Clear CMOS Jumper........................................................................................ 25
3.7 M OUNTING THE S YSTEM .......................................................................................... 27
3.7.1 Mounting the System with Mounting Brackets................................................. 27
3.7.2 Mounting the System with Wall Mounting Kit (Optional)................................ 28