HP ProLiant DL760 G2 Server - Manual (Page 78)

Server Access
Server I/O Lid and Modules
The ProLiant DL760 G2 server chassis facilitates the installation of hardware
upgrades through the use of three removable modules and a sliding I/O lid. The
following table describes the contents of the modules and how to access the
components.
Table 3-1: Module and Bay Components and Access
Module Contents Access Method
PCI Hot Plug expansion slots Slide the I/O lid toward the
front of the server.
Configuration switches Slide the I/O lid toward the
front of the server.
I/O module with system fans
Hot-plug fans 1 and 2 Slide the I/O lid toward the
front of the server.
Processor sockets Remove the processor and
memory module and the
processor board. Processor and memory
module
Memory (DIMMs) Remove the memory cartridge.
CD-ROM/
Diskette/IMD Access directly at the front of
the server. Media module
Hot-plug hard drives Access directly at the front of
the server.
The following sections provide instructions for removing the processor and memory
module, media module, and I/O module. For information pertaining to PCI Hot Plug
and hot-plug fan access, refer to Chapter 5.
CAUTION: Do not attempt to remove any of the three modules while power is
applied to the system. They are not hot-pluggable. Immediate system shutdown and
data loss will occur.
3-2 HP ProLiant DL760 Generation 2 Server User Guide
HP CONFIDENTIAL
Writer: Jennifer Hayward File Name: d-ch3 Server Access.doc
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