Rainbow Electronics MAX14821 - Manual (Page 3)

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MAX14821
IO-Link Device Transceiver
(All voltages referenced to GND, unless otherwise noted.)
V
CC
.........................................................................-40V to +40V
V
P
(I
VP
< 50mA) ..... the higher of -0.3V and (V
CC
- 1V) to +40V
LDOIN ....................................................................-0.3V to +40V
V
5
..................... -0.3V to the lesser of (V
LDOIN
+ 0.3V) and +6V
LDO33 ..................... -0.3V to the lesser of (V
5
+ 0.3V) and +6V
V
L
.............................................................................-0.3V to +6V
DI ...........................................................................-40V to +40V
C/Q, DO ...................... MIN: the higher of -40V and (V
CC
- 40V)
MAX: the lesser of +40V and (V
CC
+ 40V)
Logic Inputs
TXC, TXQ, TXEN, LO, CS, SDI, SCLK ..... -0.3V to (V
L
+ 0.3V)
Logic Outputs
RX, WU, LI, SDO, IRQ ............................. -0.3V to (V
L
+ 0.3V)
UV ........................................................................-0.3V to +6V
Continuous Current Into Any Logic Pin ........................... Q50mA
Continuous Power Dissipation
TQFN (derate 27.8mW/NC above +70NC)..................2222mW
WLP (derate 22.7mW/NC above +70NC)....................1816mW
Operating Temperature Range .......................... -40NC to +85NC
Maximum Junction Temperature .....................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (TQFN only; soldering, 10s) .............+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (B
JA
) ..........36NC/W
Junction-to-Case Thermal Resistance (B
JC
) .................3NC/W
WLP
Junction-to-Ambient Thermal Resistance (B
JA
) ..........44NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial .
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
DC ELECTRICAL CHARACTERISTICS
(V
CC
= 18V to 36V, V
L
= 2.3V to 5.5V, V
GND
= 0V; all logic inputs at V
L
or GND; T
A
= -40NC to +85NC, unless otherwise noted. Typical
values are at V
CC
= 24V, V
L
= 3.3V, and T
A
= +25NC, unless otherwise noted.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
V
CC
Supply Voltage V
CC
For driver operation 9 36 V
V
CC
Supply Current I
CC
V
CC
= 24V, C/Q as input, no load on V
5
or LDO33, LDOIN not connected to V
P
,
V
LDOIN
= 24V
1 2.5 mA
V
CC
Undervoltage-Lockout
Threshold
V
CCUVLO
V
CC
falling 6 7.4 9 V
V
CC
Undervoltage-Lockout
Threshold Hysteresis
V
CCUVLO_HYST
200 mV
V
5
Supply Current I
5_IN
LDOIN shorted to V
5
, external 5V applied
to V
5
, no switching, LDO33 disabled
3 mA
V
5
Undervoltage-Lockout
Threshold
V
5UVLO
V
5
falling 2.0 V
V
L
Logic-Level Supply Voltage V
L
2.3 5.5 V
V
L
Logic-Level Supply Current I
L
All logic inputs at V
L
or GND 5 F A
V
L
Undervoltage Threshold V
LUVLO
V
L
falling 0.65 0.95 1.30 V
5V LDO (V
5
)
LDOIN Input Voltage Range V
LDOIN
7 36 V
LDOIN Supply Current I
LDOIN
V
LDOIN
= 24V, C/Q is configured as an
input, no load on V
5
or LDO33
2.5 5 mA