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Pin/bump configurations, Pin/bump descriptions, Pin/bump configurations pin/bump descriptions – Rainbow Electronics MAX14821 User Manual

Page 14

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MAX14821

IO-Link Device Transceiver

Pin/Bump Configurations

Pin/Bump Descriptions

PIN

NAME

FUNCTION

TQFN-EP

WLP

1

A2

LDOIN

5V Linear Regulator Input. Bypass LDOIN to GND with a 0.1FF ceramic capacitor.

2

A3

V

5

5V Power-Supply Input and 5V Linear Regulator Output. Bypass V

5

to GND with a 0.1FF

ceramic capacitor for 10mA load capability. Add the recommended compensation network
to increase the source capability to 30mA. See the 5V and 3.3V Linear Regulators section for
more information.

3

A4

LDO33

3.3V Linear Regulator Output. Bypass LDO33 to GND with a 1FF ceramic capacitor.

4

B3

IRQ

Active-Low Interrupt Request Output. IRQ is a push-pull output referenced to V

L

.

5

A5

SCLK

SPI Clock Input

6

B4

CS

Active-Low SPI Chip-Select Input

7

B5

SDO

SPI Serial-Data Output

8

C4

SDI

SPI Serial-Data Input

9

C5

V

L

Logic-Level Supply Input. V

L

defines the logic levels on all the logic inputs and outputs.

Bypass V

L

to GND with a 0.1FF ceramic capacitor.

10

C3

I.C.

Internally Connected. Connect to V

L

or leave unconnected.

23

24

22

21

8

7

9

V

5

IRQ

SCLK

CS

10

LDOIN

LI

WU

RX

UV

TXEN

1

2

DO

4

5

6

17

18

16

14

13

V

CC

V

P

I.C.

V

L

SDI

SDO

*EP

*CONNECT EXPOSED PAD TO GND.

LDO33

LO

3

15

C/Q

20

11 TXQ

GND

19

12 TXC

DI

TQFN

TOP VIEW

+

MAX14821

MAX14821

TOP VIEW

(BUMP SIDE DOWN)

A

B

C

D

WLP

E

1

2

3

4

V

CC

LDOIN

V

5

LDO33

SCLK

C/Q

V

P

IRQ

SDO

GND

GND

I.C.

SDI

V

L

DO

UV

TXC

TXQ

DI

LI

LO

RX

TXEN

5

+

CS

WU