Adv ance informa tion – Texas Instruments TMS320C6202 User Manual
Page 24
TMS320C6202
FIXED-POINT DIGITAL SIGNAL PROCESSOR
SPRS072B – AUGUST 1998 – REVISED AUGUST 1999
24
POST OFFICE BOX 1443
•
HOUSTON, TEXAS 77251–1443
device and development-support tool nomenclature (continued)
PREFIX
DEVICE SPEED RANGE
TMS 320
C 6202
GJL
–250
TMX = Experimental device
TMP = Prototype device
TMS = Qualified device
SMJ = MIL-STD-883C
SM = High Rel (non-883C)
DEVICE FAMILY
320 = TMS320 family
TECHNOLOGY
–100 MHz
–150 MHz
–167 MHz
–200 MHz
–233 MHz
–250 MHz
–300 MHz
PACKAGE TYPE†
N
= Plastic DIP
J
= Ceramic DIP
JD
= Ceramic DIP side-brazed
GB
= Ceramic PGA
FZ
= Ceramic CC
FN
= Plastic leaded CC
FD
= Ceramic leadless CC
PJ
= 100-pin plastic EIAJ QFP
PQ
= 132-pin plastic bumpered QFP
PZ
= 100-pin plastic TQFP
PBK = 128-pin plastic TQFP
PGE = 144-pin plastic TQFP
GFN = 256-pin plastic BGA
GGU = 144-pin plastic BGA
GGP = 352-pin plastic BGA
GJC = 352-pin plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
C = CMOS
E = CMOS EPROM
F = CMOS Flash EEPROM
DEVICE
’1x DSP:
10
16
14
17
15
’2x DSP:
25
26
’2xx DSP:
203
206
240
204
209
’3x DSP:
30
31
32
’4x DSP:
40
44
’5x DSP:
50
53
51
56
52
57
’54x DSP:
541
545
542
546
543
548
’6x DSP:
6201
6201B
6202
6203
6211
6701
6711
† DIP
=
Dual-In-Line Package
PGA =
Pin Grid Array
CC
=
Chip Carrier
QFP
=
Quad Flat Package
TQFP =
Thin Quad Flat Package
BGA =
Ball Grid Array
TEMPERATURE RANGE (DEFAULT: 0
°
C TO 90
°
C)
(A)
Blank = 0
°
C to 90
°
C, commercial temperature
A
= –40
°
C to 105
°
C, extended temperature
Figure 5. TMS320 Device Nomenclature (Including TMS320C6202)
ADV
ANCE INFORMA
TION