Freescale Semiconductor 56F8122 - Manual (Page 131)

56F8122 Package and Pin-Out Information
56F8322 Technical Data, Rev. 10.0
Freescale Semiconductor 131
Preliminary
Figure 11-3 48-Pin LQFP Mechanical Information
A
A1
Z 0.200 AB T-U
4X
Z 0.200 AC T-U
4X
B
B1
1
12
13 24
25
36
37 48
S1
S
V
V1
P
AE AE
T, U, Z
DETAIL Y
DETAIL Y
BASE METAL
N J
F
D
T-U M 0.080 Z AC
SECTION AE-AE
AD
G
0.080 AC
M
°
TOP & BOTTOM
L
°
W
K
AA
E
C
H
0.2
50
R
9
DETAIL AD
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE AB IS LOCATED AT BOTTOM OF LEAD
AND IS COINCIDENT WITH THE LEAD WHERE THE
LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF
THE PARTING LINE.
4. DATUMS T, U, AND Z TO BE DETERMINED AT DATUM
PLANE AB.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE AC.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.250
PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD
MISMATCH AND ARE DETERMINED AT DATUM PLANE
AB.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL NOT
CAUSE THE D DIMENSION TO EXCEED 0.350.
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076.
9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.
T U
Z
AB
AC
G
A
UG
E PL
A
N
E
DIM
A
MIN MAX
7.000 BSC
MILLIMETERS
A1 3.500 BSC
B 7.000 BSC
B1 3.500 BSC
C 1.400 1.600
D 0.170 0.270
E 1.350 1.450
F 0.170 0.230
G 0.500 BSC
H 0.050 0.150
J 0.090 0.200
K 0.500 0.700
M 12 REF
N 0.090 0.160
P 0.250 BSC
L 0 7
R 0.150 0.250
S 9.000 BSC
S1 4.500 BSC
V 9.000 BSC
V1 4.500 BSC
W 0.200 REF
AA 1.000 REF
°
° °