Freescale Semiconductor MC68HC908MR32 - Manual (Page 272)

Electrical Specifications
MC68HC908MR32 • MC68HC908MR16 Data Sheet, Rev. 6.1
272 Freescale Semiconductor
19.9 TImer Interface Module Characteristics
19.10 Clock Generation Module Component Specifications
19.11 CGM Operating Conditions
Characteristic Symbol Min Max Unit
Input capture pulse width t
TIH,
t
TIL
125 — ns
Input clock pulse width t
TCH,
t
TCL
(1/f
OP
) + 5 — ns
Characteristic Symbol Min Typ Max Notes
Crystal load capacitance C
L
— — —
Consult crystal
manufacturing data
Crystal fixed capacitance C
1
— 2 * C
L
—
Consult crystal
manufacturing data
Crystal tuning capacitance C
2
— 2 * C
L
—
Consult crystal
manufacturing data
Feedback bias resistor R
B
— 22 M Ω —
Series resistor R
S
0 330 k Ω 1 M Ω Not required
Filter capacitor C
F
—
C
FACT
*
(V
DDA
/f
XCLK
)
—
Bypass capacitor C
BYP
— 0.1 µF —
C
BYP
must provide low ac
impedance from
f = f
XCLK
/100 to 100*f
VCLK
, so
series resistance must be
considered
Characteristic Symbol Min Typ Max Unit
Crystal reference frequency f
XCLK
1 — 8 MHz
Range nominal multiplier f
NOM
— 4.9152 — MHz
VCO center-of-range frequency f
VRS
4.9152 — 32.8 MHz
VCO frequency multiplier N 1 — 15 —
VCO center of range multiplier L 1 — 15 —
VCO operating frequency f
VCLK
f
VRSMIN
— f
VRSMAX
—