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Special features, Design considerations, System resources – Kontron COMe-cPV2(v1.4) User Manual

Page 3

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4.1.3

 

Connectors J2 and J3 – SODIMM DDR2 Memory Sockets .................. 35

 

4.1.4

 

Connector J4 - XDP ................................................. 35

 

4.1.5

 

Connector J5 –JTAG ................................................. 36

 

4.1.6

 

SSD Mezzanine Connector ............................................ 36

 

4.1.7

 

PCI Express Interface .............................................. 37

 

4.1.8

 

USB Interface ...................................................... 37

 

4.1.9

 

SATA Interface ..................................................... 38

 

4.1.10

 

Audio Interface ................................................ 39

 

4.1.11

 

Serial IRQ ..................................................... 39

 

4.1.12

 

Graphics Interface ............................................. 39

 

4.1.13

 

Ethernet Interface ............................................. 40

 

4.1.14

 

SPI Bus Interface .............................................. 40

 

4.1.15

 

LPC Bus Interface .............................................. 40

 

4.1.16

 

Power Control Interface ........................................ 43

 

4.1.17

 

Miscellaneous Circuits ......................................... 46

 

5

 

Special Features ............................... 48

 

5.1

 

Hyper-Threading ..................................................... 48

 

5.2

 

Enhanced SpeedStep™ Technology ...................................... 48

 

5.3

 

Onboard Hardware Monitor ............................................ 48

 

5.4

 

Watchdog ............................................................ 49

 

5.5

 

JIDA non volatile and CMOS setting. ................................. 49

 

5.6

 

General Purpose Input and Output (GPIO) ............................. 50

 

5.7

 

Fast I

2

C ............................................................ 50

 

5.8

 

ACPI Suspend Modes and Resume Events ................................ 50

 

6

 

Design Considerations .......................... 52

 

6.1

 

Thermal Management .................................................. 52

 

6.2

 

Heat Spreader Dimensions ............................................ 52

 

6.3

 

Onboard Fan Connector ............................................... 52

 

6.3.1

 

Fan Connector Electrical Characteristics ........................... 54

 

7

 

System Resources ............................... 55

 

7.1

 

Interrupt Request (IRQ) Lines ....................................... 55

 

7.2

 

Memory Area ......................................................... 58