Kontron COMe-cP2020 - Manual (Page 18)

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COMe-P2020 User Guide
18
1.5 Related Publications
NOTICE
Kontron performs comprehensive environmental testing of its products in accordance with appli-
cable standards.
Customers desiring to perform further environmental testing of Kontron products must contact
Kontron for assistance prior to performing any such testing. This is necessary, as it is possible
that environmental testing can be destructive when not performed in accordance with the appli-
cable specifications.
In particular, for example, boards without conformal coating must not be exposed to a change of
temperature exceeding 1K/minute, averaged over a period of not more than five minutes. Other-
wise, condensation may cause irreversible damage, especially when the board is powered up
again.
Kontron does not accept any responsibility for damage to products resulting from destructive
environmental testing.
Table 1-3: Related Publications
SPECIFICATION /
ORGANIZATION
PUBLICATION
COM Express PICMG® COM.0, COM Express® Module Base Specification, Revision 2.0, August 8, 2010
Freescale, Kontron and Emerson Common Pinout Definition
PCI Express PCI Express Base Specification Revision 2.0, Dec. 20, 2006
Serial RapidIO RapidIO ™ Interconnect Specification Part 6: LP-Serial Physical Layer Specification,
Rev. 2.0.1, March 2008
Ethernet IEEE802.3: Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD)
Access Method and Physical Layer Specification, Clause 22
Platform Firmware DENX “U-Boot” (Universal Boot Loader) online documentation at www.denx.de
Kontron Kontron’s Product Safety and Implementation Guide, ID 1021-9142