Rainbow Electronics T89C51CC01 - Manual (Page 133)

133
T89C51CC01
Rev. D – 17-Dec-01
19. Electrical Characteristics
19.1 Absolute Maximum
Ratings
(1)
19.2 DC Parameters for Standard Voltage
T A = -40
°
C to +85
°
C; V
SS
= 0 V; V
CC
= 5 V
±
10%; F = 0 to 40 MHz.
Table 93. DC Parameters in Standard Voltage
Ambiant Temperature Under Bias:
I = industrial.................................................-40 ° C to 85 ° C
Storage Temperature ............................-65
°
C to + 150
°
C
Voltage on V
CC
from V
SS..........................................
-0.5 V to + 6V
Voltage on Any Pin from V
SS
............-0.5 V to V
CC
+ 0.2 V
Power Dissipation................................................... 1 W (2)
Symbol Parameter Min Typ (5) Max Unit Test Conditions
V
IL
Input Low Voltage -0.5
0.2Vcc -
0.1
V
V
IH
Input High Voltage except XTAL1,
RST 0.2 V
CC
+
0.9
V
CC
+ 0.5 V
V
IH1
Input High Voltage, XTAL1, RST 0.7 V
CC
V
CC
+ 0.5 V
V
OL
Output Low Voltage, ports 1, 2, 3
and 4
(6)
0.3
0.45
1.0
V
V
V
I
OL
= 100 µ A (4)
I
OL
= 1.6 mA (4)
I
OL
= 3.5 mA (4)
V
OL1
Output Low Voltage, port 0, ALE,
PSEN
(6)
0.3
0.45
1.0
V
V
V
I
OL
= 200 µ A (4)
I
OL
= 3.2 mA (4)
I
OL
= 7.0 mA (4)
V
OH
Output High Voltage, ports 1, 2, 3,
4 and 5
V
CC
- 0.3
V
CC
- 0.7
V
CC
- 1.5
V
V
V
I
OH
= -10 µ A
I
OH
= -30 µ A
I
OH
= -60 µ A
V
CC
= 5 V ± 10%
V
OH1
Output High Voltage, port 0, ALE,
PSEN
V
CC
- 0.3
V
CC
- 0.7
V
CC
- 1.5
V
V
V
I
OH
= -200 µ A
I
OH
= -3.2 mA
I
OH
= -7.0 mA
V
CC
= 5 V ± 10%
R
RST
RST Pulldown Resistor 20 40 200 k Ω
I
IL
Logical 0 Input Current ports 1, 2,
3 and 4
-50 µ A Vin = 0.45 V
I
LI
Input Leakage Current ± 10 µ A
0.45 V < Vin <
V
CC
Note: Stresses at or above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in
the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions may affect
device reliability.This value is based on the maximum allow-
able die temperature and the thermal resistance of the
package.