Kontron ETXexpress-AI - Manual (Page 8)

Kontron ETXexpress-AI User’s Guide
3
2 Introduction
2.1 The ETXexpress®-AI COM
The Kontron ETXexpress®-AI Computer-on-Module (COM) extends the COM Express™
specification to include a basic form factor (125mmx95mm) module with the
commonly used COM Express™ Type 2 connector or new Type 6 connector for use
in graphics-intensive applications for the high-end performance sector. The
ETXexpress®-AI COM design enables the development of high-performance,
customized, energy efficient applications based on the 32-nm Intel® Core
TM
i7/Core TM i5 processor technology and the Mobile Intel® QM57 Platform
Controller Hub. This module also provides the secure development path of an
established, future-proof PICMG COM Express
TM industry standard.
The Kontron ETXexpress®-AI module processor technology supports an integrated
memory controller for up to 8 GBytes of dual-channel DDR3 SODIMM RAM with ECC
support (2x 204-pin SODIMM sockets) and integrated 45nm HD graphics with
DisplayPort (DP) support. With a comprehensive set of interfaces on the COM
Express Type 2 or Type 6 connector, including 1xPCI Express*Gen 2 graphics
(PEG), 6xPCI Express x1,4xSATA, 1xPATA (Type 2 only), SDVO/DP/DVI/HDMI (Type
6 only), 8xUSB 2.0, Gigabit Ethernet, dual-channel LVDS, VGA, and Intel® High
Definition Audio, this module offers improved computing and graphics
performance. These special features make this 125mmx95mm Computer-on-Module a
key solution for applications like gaming, digital signage,
network/telecommunications, medical technology, automation, and MAG
(military, aerospace, government) that require application-specific
customization for rapid time-to-market.
All modules in the Kontron ETXexpress® family are compatible with the COM
Express™ standard (connector pin-out Type 2 and now the new Type 6) and thus
ensure easy interchangeability as well as design scalability and future
migration paths.
2.2 Naming Clarifications
The COM Express™ standard defines a Computer-On-Module, or COM, with all the
components necessary for a bootable host computer, packaged as a super-
component. The interfaces provide a smooth transition path from legacy
parallel interfaces to Low Voltage Differential Signaling (LVDS) interfaces